Notification No 21/2019 Customs date on 6th July, 2019

dth="451">

Parts of apparatus for wet-etching, developing, stripping or cleaning

 

8543 90 00 or

semiconductor wafers and flat panel displays.

 

8486

 

 

 

 

41.

8479 90 or 8486

Parts of automated machines for transport, handling and storage of

 

 

semiconductor  wafers,  wafer  cassettes,  wafer  boxes  and  other

 

 

material for semiconductor devices.

 

 

 

42.

8479 90 or 8486

Parts   of   machines   for   bending,   folding   and   straightening

 

 

semiconductor leads.

 

 

 

43.

8479 90 or

Parts of physical deposition apparatus for semiconductor production.

 

8486

 

 

 

 

44.

8480 71 00 or

Injection   and   compression   moulds   for   manufacture   of

 

8486

semiconductor devices.

 

 

 

45.

8514 10 00 or

Resistance  heated  furnaces  and  ovens  for  the  manufacture  of

 

8486

semiconductor devices on semiconductor wafers.

 

 

 

46.

8514 20 00 or

Inductance or dielectric furnaces and ovens for the manufacture of

 

8486

semiconductor devices on semiconductor wafers.

 

 

 

47.

8514 30 or 8486

Parts of resistance heated furnaces and ovens for the manufacture of

 

 

semiconductor devices on semiconductor wafers.

 

 

 

48.

8514 30 or 8486

Apparatus for rapid heating of semiconductor wafers.

 

 

 

49.

8514 90 00 or

Parts of furnaces and ovens of heading Nos. 8514 10 to 8514 30 or

 

8486

8486.

 

 

 

50.

8514 90 00 or

Parts of apparatus for rapid heating of wafers.

 

8486

 

 

 

 

51.

8543 10 10 or

Ion implanters for doping semiconductor materials.

 

8486

 

 

 

 

 

CUSTOMS Notification No 21 of 2019 dated 6th July, 2019

  

Seeks to further amend notification No 25/98-Customs dated 2nd June 1998 to update the classification of the goods in the notification. 

The extract of CUSTOMS Notification No. 21/2019- CUSTOMS is given below: 

 Notification No. 21/2019-CUSTOMS

 

 [TO BE PUBLISHED IN THE GAZETTE OF INDIA, EXTRAORDINARY, PART II, SECTION 3, SUB-SECTION (i)]

 

GOVERNMENT OF INDIA

MINISTRY OF FINANCE

(DEPARTMENT OF REVENUE) 

Notification No. 21/2019 – Customs

 

New Delhi, the 6th July, 2019

 

G.S.R. …(E).- In exercise of the powers conferred by sub-section (1) of section 25 of the Customs Act, 1962 (52 of 1962), the Central Government, on being satisfied that it is necessary in the public interest so to do, hereby makes the following further amendments in the notification of the Government of India, Ministry of Finance (Department of Revenue), No. 25/1998-Customs, dated the 2nd June, 1998, Published in the Gazette of India, Extraordinary, Part II, section 3, sub-section (i), vide G.S.R. 290(E), dated the 2nd June, 1998, namely:-

 

In the said notification, -

 

(i)             in the opening paragraph, for the words “sub-heading Nos.”, the words “heading, sub-heading or tariff item” shall be substituted;

 

(ii)             for the TABLE, the following TABLE shall be substituted, namely: -

 

52.

8543 or

Pattern generating apparatus of a kind used for producing masks or

 

9017 20

reticles from photoresist coated substrates.

 

 

 

53.

8543 90 00 or

Parts of ion implanters for doping semiconductor materials.

 

8486

 

 

 

 

54.

8543 90 00 or

Parts and accessories of pattern generating apparatus of a kind used

 

9017 90 00

for producing masks or reticles from photoresist coated substrates.

 

 

 

55.

8486 20 00

Apparatus  for  the  projection  or  drawing  of  circuit  patterns  on

 

 

sensitised semiconductor materials.

 

 

 

56.

8486 90 00

Parts and accessories of the apparatus of heading Nos. 901041 to

 

 

901049

 

 

 

57.

9011 10 00

Optical stereoscopic microscopes fitted with equipment specifically

 

 

designed for the handling and transport of semiconductor wafers or

 

 

reticles.

 

 

 

58.

9011 20 00

Photomicrographic microscopes fitted with equipment specifically

 

 

designed for the handling and transport of semiconductor wafers or

 

 

reticles.

 

 

 

59

9011 90 00

Parts and accessories of optical stereoscopic microscopes fitted with

 

 

equipment specifically designed for the handling and transport of

 

 

semiconductor wafers or reticles.

 

 

 

60.

9011 90 00

Parts and accessories of photomicrographic microscopes fitted with

 

 

equipment specifically designed for the handling and transport of

 

 

semiconductor wafers or reticles.

 

 

 

61.

9012 10

Electron  beam  microscopes  fitted  with  equipment  specifically

 

 

designed for the handling and transport of semiconductor wafers or

 

 

reticles.

 

 

 

62.

9012 90 00

Parts  and  accessories  of  electron  beam  microscopes  fitted  with

 

 

equipment specifically designed for the handling and transport of

 

 

semiconductor wafers or reticles.

 

 

 

63.

9030 90

Parts and accessories of instruments and apparatus and parts of

 

 

appliances  for  measuring  or  checking  semiconductor  wafers  or

 

 

devices.

 

 

 

64.

9031 41 00

Optical instruments and appliances, for inspecting semiconductor

 

 

wafers or devices or for inspecting photomasks or reticles used in

 

 

manufacturing semiconductor devices.

 

 

 

“TABLE

 

 

 

S.

Heading or

Description

No.

Sub-

 

 

heading or

 

 

tariff Item

 

 

 

 

(1)

(2)

(3)

 

 

 

1.

7017 10 00 or

Quartz reactor tubes and holders designed for insertion into diffusion

 

7020 00

and oxidation furnaces for production of semi-conductor wafers.

 

 

 

2.

8419 89 or 8486

Chemical   vapour   deposition   apparatus   for   semi-conductor

 

 

production.

 

 

 

3.

8419 90 or 8486

Parts of chemical vapour deposition apparatus for semi-conductor

 

 

production.

 

 

 

4.

8421 19 or 8486

Spin dryers for semi-conductor wafer processing.

 

 

 

 

5.

8421 91 00 or

Parts of Spin dryers for semi-conductor wafer processing.

 

8486

 

 

 

 

6.

8424 89 or 8486

Deflash machines for cleaning and removing contaminants from the

 

 

metal leads of semiconductor packages prior to the electroplating

 

 

process.

 

 

 

7.

8424 89 or 8486

Spraying  appliances  for  etching,  stripping  or  cleaning  semi-

 

 

conductor wafers.

 

 

 

8.

8424 90 00 or

Parts of spraying appliances for etching, stripping or cleaning semi-

 

8486

conductor wafers.

 

 

 

9.

8456 11 00 or

Machines for working any material by removal of material, by laser

 

8456 12 00 or

or other light or photo beam in the production of semiconductor

 

8486

wafers.

 

 

 

10.

8456 90 10 or

Machine tools for working any material by removal of material, by

 

8486

laser or other light or photon beam, ultrasonic, electro-discharge,

 

 

electro-chemical,  electron  beam,  ionic-beam  or  plasma  arc

 

 

processes, for dry-etching patterns on semiconductor materials of the

 

 

said First Schedule.

 

 

 

11.

8486 40 00

Focussed ion beam milling machines to produce or repair masks and

 

 

reticles for patterns on semiconductor devices.

 

 

 

12.

8456 90 90 or

Laser  cutters  for  cutting  contacting  tracks  in  semiconductor

 

 

 

65.

9031 49 00

Optical instruments and appliances for measuring surface particulate

 

 

contamination on semiconductor wafers.

 

 

 

66.

9031 90 00

Parts  and  accessories  of  optical  instruments  and  appliances  for

 

 

inspecting semiconductor wafers or devices or for inspecting masks,

 

 

photomasks  or  reticles  used  in  manufacturing  semiconductor

 

 

devices.

 

 

 

67.

9031 90 00

Parts  and  accessories  of  optical  instruments  and  appliances  for

 

 

measuring  surface  particulate  contamination  on  semiconductor

 

 

wafers.

 

 

 

68.

Any Chapter

All goods required for the manufacture of goods specified against

 

 

S.Nos. 1 to 67 above, subject to the condition that the importer

 

 

follows the procedure set out in the Customs (Import of Goods at

 

 

Concessional Rate of Duty) Rules, 2017.”.

 

 

 

 

[F. No. 334/3/2019-TRU] 

 

 

(Gunjan Kumar Verma)

 

Under Secretary to the Government of India

 

Note: The principal notification No.25/98-Customs, dated the 2nd June, 1998 was published in the Gazette of India, Extraordinary, Part II, Section 3, Sub-section (i), vide number G.S.R.290(E), dated the 2nd June, 1998 and last amended, vide, notification No. 125/2006 -Customs, dated the 30th December, 2006, published, vide number G.S.R.786(E), dated the 30th December, 2006.

 

8486

production by laser beam.

 

 

 

13.

8464 10 or 8486

Machines for sawing monocrystal semiconductor boules into slices,

 

 

or wafers into chips.

 

 

 

14.

8464 20 00 or

Grinding,  polishing  and  lapping  machines  for  processing  of

 

8486

semiconductor wafers.

 

 

 

15.

8464 90 00 or

Dicing machines for scribing or scoring semiconductor wafers.

 

8486

 

 

 

 

16.

8466 91 00 or

Parts of grinding, polishing and lapping machines for processing of

 

8486

semiconductor wafers.

 

 

 

17.

8466 91 00 or

Parts of machines for sawing monocrystal semiconductor boules into

 

8486

slices, or wafers into chips.

 

 

 

18.

8466 91 00 or

Parts  of  dicing machines  for  scribing or  scoring semiconductor

 

8486

wafers.

 

 

 

19.

8466 93 or 8486

Parts of focussed ion beam milling machines to produce or repair

 

 

masks and reticles for patterns on semiconductor devices.

 

 

 

20.

8466 93 or 8486

Parts of machines for working any material by removal of material,

 

 

by  laser  or  other  light  or  photo  beam  in  the  production  of

 

 

semiconductor wafers.

 

 

 

21.

8466 93 or 8486

Parts  of  machines  for  dry-etching  patterns  on  semiconductor

 

 

materials.

 

 

 

22.

8466 93 or 8486

Parts of laser cutters for cutting contacting tracks in semiconductor

 

 

production by laser beam.

 

 

 

23.

8466 93 or 8486

Parts of apparatus for stripping or cleaning semiconductor wafers.

 

 

 

24.

8477 10 00 or

Encapsulation equipment for assembly of semiconductors.

 

8479 89

 

 

 

 

25.

8477 90 00 or

Parts of encapsulation equipment for assembly of semiconductors.

 

8479 90

 

 

 

 

26.

8479 50 00 or

Automated  machines  for  transport,  handling  and  storage  of

 

8486

semiconductor wafers, cassettes, wafer boxes and other material for

 

 

semiconductor devices.

 

 

 

27.

8479 89 or 8486

Apparatus  for  growing  or  pulling  moriocrystal  semiconductor

 

 

boules.

 

 

 

28.

8479 89 or 8486

Epitaxial deposition machines for semiconductor wafers.

 

 

 

29.

8479 89 or 8486

Apparatus for physical deposition by sputtering on semiconductor

 

 

wafers.

 

 

 

30.

8479 89 or

Apparatus  for  wet-etching,  developing,  stripping  or  cleaning

 

8543 30 00 or

semiconductor wafers and flat panel displays.

 

8486

 

 

 

 

31.

8479 89 or 8486

Die attach apparatus, tape automated bonders and wire bonders for

 

 

assembly of semiconductors.

 

 

 

32.

8479 89 or 8486

Machines  for  bending,  folding  and  straightening  semiconductor

 

 

leads.

 

 

 

33.

8479 89 or 8486

Physical deposition apparatus for semiconductor production.

 

 

 

34.

8479 89 or 8486

Spinners  for  coating  photographic  emulsions  on  semiconductor

 

 

wafers.

 

 

 

35.

8479 90 or 8486

Parts of apparatus for growing or pulling monocrystal semiconductor

 

 

boules.

 

 

 

36.

8479 90 or 8486

Parts of epitaxial deposition machines for semiconductor wafers.

 

 

 

37.

8479 90 or 8486

Parts  of  apparatus  for  physical  deposition  by  sputtering  on

 

 

semiconductor wafers.

 

 

 

38.

8479 90 or 8486

Parts for die attach apparatus, tape automated bonders and wire

 

 

bonders for assembly of semiconductors.

 

 

 

39.

8479 90 or 8486

Parts   of   spinners   for   coating   photographic   emulsions   on

 

 

semiconductor wafers.

 

 

 

40.

8479 90 or


Discussion Forum

You can also share your thoughts about this article.
Any one can answer on question posted by Readers